Samtec Inc. Header, 2.54Mm, Low Profile, 23 Position; Pitch Spacing Samtec BBL-123-T-E

Description
HEADER, 2.54MM, LOW PROFILE, 23 POSITION; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:23Contacts; Contact Termination Type:Through Hole; Product Range:BBL Series; Contact Material:Phosphor Bronze; Gender:Header RoHS Compliant: Yes
  • Header, 2.54Mm, Low Profile, 23 Position; Pitch Spacing Samtec - 11P3097 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
HEADER, 2.54MM, LOW PROFILE, 23 POSITION; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:23Contacts; Contact Termination Type:Through Hole; Product Range:BBL Series; Contact Material:Phosphor Bronze; Gender:Header RoHS Compliant: Yes

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Header, 2.54Mm, Low Profile, 23 Position; Pitch Spacing Samtec - 11P3097 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Header, 2.54Mm, Low Profile, 23 Position; Pitch Spacing Samtec
11P3097
Header, 2.54Mm, Low Profile, 23 Position; Pitch Spacing Samtec 11P3097
HEADER, 2.54MM, LOW PROFILE, 23 POSITION; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:23Contacts; Contact Termination Type:Through Hole; Product Range:BBL Series; Contact Material:Phosphor Bronze; Gender:Header RoHS Compliant: Yes

HEADER, 2.54MM, LOW PROFILE, 23 POSITION; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:23Contacts; Contact Termination Type:Through Hole; Product Range:BBL Series; Contact Material:Phosphor Bronze; Gender:Header RoHS Compliant: Yes

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Technical Specifications

  Newark, An Avnet Company
Product Category IC Interconnect Components
Product Number 11P3097
Product Name Header, 2.54Mm, Low Profile, 23 Position; Pitch Spacing Samtec
Product Type IC Headers
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