Samtec Inc. Header, 2.54Mm, Low Profile, 8 Position; Pitch Spacing Samtec BBL-108-T-F

Description
HEADER, 2.54MM, LOW PROFILE, 8 POSITION; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:8Contacts; Contact Termination Type:Through Hole; Product Range:BBL Series; Contact Material:Phosphor Bronze; Gender:Header RoHS Compliant: Yes
Datasheet
Description
HEADER, 2.54MM, LOW PROFILE, 8 POSITION; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:8Contacts; Contact Termination Type:Through Hole; Product Range:BBL Series; Contact Material:Phosphor Bronze; Gender:Header RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Header, 2.54Mm, Low Profile, 8 Position; Pitch Spacing Samtec - 11P3039 - Newark, An Avnet Company
Chicago, IL, United States
Header, 2.54Mm, Low Profile, 8 Position; Pitch Spacing Samtec
11P3039
Header, 2.54Mm, Low Profile, 8 Position; Pitch Spacing Samtec 11P3039
HEADER, 2.54MM, LOW PROFILE, 8 POSITION; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:8Contacts; Contact Termination Type:Through Hole; Product Range:BBL Series; Contact Material:Phosphor Bronze; Gender:Header RoHS Compliant: Yes

HEADER, 2.54MM, LOW PROFILE, 8 POSITION; Pitch Spacing:2.54mm; No. of Rows:1Rows; No. of Contacts:8Contacts; Contact Termination Type:Through Hole; Product Range:BBL Series; Contact Material:Phosphor Bronze; Gender:Header RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category IC Interconnect Components
Product Number 11P3039
Product Name Header, 2.54Mm, Low Profile, 8 Position; Pitch Spacing Samtec
Product Type IC Headers
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