Samtec Inc. Connectors, Interconnects - Sockets for ICs, Transistors APA-308-G-N

2.00 mm FleXYZ High-Density Board Stacke

Win Source Part Number: 1045324-APA-308-G-N
Category: Connectors, Interconnects>Sockets for ICs, Transistors
Series: APA
Features: Open Frame
Termination: Solder
Package: Tube
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating: UL94 V-0
Standard Package: 57
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Phosphor Bronze
Mounting Type: Through Hole
Alternative Parts (Cross-Reference): 5103309-1; 5103308-2; 5103309-5; 90130-1210; 02-08-2004; 70246-1001;
ECCN: EAR99
Fake Threat In the Open Market: 65 pct.
MSL Level: Not Applicable
HTSUS: 8536.69.4040
Mfr: Samtec Inc.
Base Product Number: APA-308

ADAPTER PLUG Product overview: APA-308-G-N from Samtec, Inc. is an Electronic Connector for board-to-board, wire-to-board, backplane, terminal, cable, and industrial interconnect applications. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include connector, interconnect, header, socket, terminal block, Electronic Connector, IC Sockets. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 409-APA-308-G-N can be used for catalog matching and distributor lookup.