Samsung Electro-Mechanics SiP(System in Package) Package Substrate

This product is developed by realizing complex functions into one system by mounting multiple ICs and passive components in a package. General Features Smaller Package size compared to individually-package d Ics Low Package Cost Superior heat dissipation characteristics Application PA(Power Amplifier), PAD(Power Amplifier Duplexer) BAW(Bulk Acoustic Wave) Filter SAW(Surface Acoustic Wave) Filter RF parts including various switches Why Samsung Features of Products (Technology) Can realize small packages and low costs as multiple ICs and passive components are integrated into one module. Small body RF-SiP substrate Small body RF-SiP substrate Can realize ultrasmall substrates for communication module deivces, such as BAW/SAW filter, FBAR, and RF MEMS Ultrasmall substrates in the size of 0.7 ㎜ 1.0 mm are realized. Technology for mass-producing products in the size of 0.7 ㎜ 1.0 ㎜ or smaller is secured. BAW : Bulk Acoustic Waive SAW : Surface Acoustic Waive FBAR : Film Bulk Acoustic Resonator MEMS : Micro Electro-Mechanical System Thin Cored RF-SiP Substrate Thin Cored RF-SiP Substrate Can realize thin cored substrates as ultrathin sheets, and the capability of driving is secured. Embedded Active (EAD) Substrate The EAD substrate is produced by embedding a semiconductor passive component or a semiconductor active component inside the substrate. When elements are embedded, electric and thermal characteristics can be enhanced, and a mounting space on the substrate can be secured. Coreless RF-SiP Substrate It can realize thin substrates by applying the coreless method. Signal characteristics can be enhanced by controlling Electromagnetic Interference (EMI) and the parasitic inductance by lowering the insulation thickness through the application of the coreless method. Thin Ni ENEPIG RF performance is possible based on the Ni thickness. 1) ENIG : Electroless Nickel Immersion Gold 2) ENEPIG : Electroless Nickel Electroless Palladium Immersion Gold