Samsung Electronics Co., Ltd. Memory IC and Storage Component K9F5608U0D-JIB0

Description
Flash, 32MX8, 30ns, PBGA63 Product overview: K9F5608U0D-JIB0 from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-K9F5608U0D-JIB0 can be used for catalog matching and distributor lookup.
Request a Quote
Description
Flash, 32MX8, 30ns, PBGA63 Product overview: K9F5608U0D-JIB0 from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-K9F5608U0D-JIB0 can be used for catalog matching and distributor lookup.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Memory IC and Storage Component - 774-K9F5608U0D-JIB0 - ERSAELECTRONICS PTE. LTD.
Singapore
Memory IC and Storage Component
774-K9F5608U0D-JIB0
Memory IC and Storage Component 774-K9F5608U0D-JIB0
Flash, 32MX8, 30ns, PBGA63 Product overview: K9F5608U0D-JIB0 from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-K9F5608U0D-JIB0 can be used for catalog matching and distributor lookup.

Flash, 32MX8, 30ns, PBGA63 Product overview: K9F5608U0D-JIB0 from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-K9F5608U0D-JIB0 can be used for catalog matching and distributor lookup.

Supplier's Site
Integrated Circuits(ICs) - 288443-K9F5608U0D-JIB0 - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits(ICs)
288443-K9F5608U0D-JIB0
Integrated Circuits(ICs) 288443-K9F5608U0D-JIB0
Manufacturer: Samsung Electro-Mechanics America, Inc. Win Source Part Number: 288443-K9F5608U0D-JI B0 Category: Integrated Circuits(ICs) Family: Memory Family Name: K9F5608U0D Alternative Parts (Cross-Reference): HY27US16561M-FPIB; HY27US16561M-FIP; HY27US16561M-FPEB; Introduction Date: January 26, 1999 ECCN: 3A991.b.1.a Estimated EOL Date: Obsolete Is this a common-used part?: Yes Popularity: High Fake Threat In the Open Market: 72 pct. Supply and Demand Status: Balance

Manufacturer: Samsung Electro-Mechanics America, Inc.
Win Source Part Number: 288443-K9F5608U0D-JIB0
Category: Integrated Circuits(ICs)
Family: Memory
Family Name: K9F5608U0D
Alternative Parts (Cross-Reference): HY27US16561M-FPIB; HY27US16561M-FIP; HY27US16561M-FPEB;
Introduction Date: January 26, 1999
ECCN: 3A991.b.1.a
Estimated EOL Date: Obsolete
Is this a common-used part?: Yes
Popularity: High
Fake Threat In the Open Market: 72 pct.
Supply and Demand Status: Balance

Buy Now

Technical Specifications

  ERSAELECTRONICS PTE. LTD. Win Source Electronics
Product Category Memory Chips Memory Chips
Product Number 774-K9F5608U0D-JIB0 288443-K9F5608U0D-JIB0
Product Name Memory IC and Storage Component Integrated Circuits(ICs)
Memory Category Flash Flash
Unlock Full Specs
to access all available technical data

Similar Products

Memory - 5962-9459901MYA - Lingto Electronic Limited
Rochester Electronics
Specs
Memory Category NVSRAM; SRAM Chip
Access Time 55 ns
Density 64 kbits
View Details
Memory IC and Storage Component - 736-DP8419V-70 - ERSAELECTRONICS PTE. LTD.
Specs
Memory Category DRAM Chip
Operating Temperature 0 to 70 C (32 to 158 F)
Package Type Bulk
View Details
2 suppliers
Memory - MYX4DD3K128M64PBG2 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category DDR3
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 1024000 kbits
View Details
Flash Memory - 1882727P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Density 2048000 kbits
Package Type WSON
View Details