Samsung Electronics Co., Ltd. 1.8V Memory IC and Storage Component K4J10324KE-HC1A

Description
GDDR3 DRAM 1Gbit 32Mx32 1.8V 136-Pin FBGA Product overview: K4J10324KE-HC1A from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.8V. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.8V, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-K4J10324KE-HC1A can be used for catalog matching and distributor lookup.
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Description
GDDR3 DRAM 1Gbit 32Mx32 1.8V 136-Pin FBGA Product overview: K4J10324KE-HC1A from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.8V. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.8V, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-K4J10324KE-HC1A can be used for catalog matching and distributor lookup.
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Suppliers

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1.8V Memory IC and Storage Component - 774-K4J10324KE-HC1A - ERSAELECTRONICS PTE. LTD.
Singapore, Singapore
1.8V Memory IC and Storage Component
774-K4J10324KE-HC1A
1.8V Memory IC and Storage Component 774-K4J10324KE-HC1A
GDDR3 DRAM 1Gbit 32Mx32 1.8V 136-Pin FBGA Product overview: K4J10324KE-HC1A from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.8V. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.8V, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-K4J10324KE-HC1A can be used for catalog matching and distributor lookup.

GDDR3 DRAM 1Gbit 32Mx32 1.8V 136-Pin FBGA Product overview: K4J10324KE-HC1A from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1.8V. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1.8V, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-K4J10324KE-HC1A can be used for catalog matching and distributor lookup.

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Technical Specifications

  ERSAELECTRONICS PTE. LTD.
Product Category Memory Chips
Product Number 774-K4J10324KE-HC1A
Product Name 1.8V Memory IC and Storage Component
Memory Category DRAM Chip
Operating Temperature 0 C (32 F)
Density 1000000 kbits
Number of Words 4000 k
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