Samsung Electronics Co., Ltd. Memory IC K4H511638D-UCB3

Description
DISCONTINUED BY MANUFACTURER, DDR1 DRAM, 32MX16, 0.7NS, CMOS, 512MB, 133/166MHZ, 66 PIN TSOP II. FREE 2 YEAR RADWELL WARRANTY
Description
DISCONTINUED BY MANUFACTURER, DDR1 DRAM, 32MX16, 0.7NS, CMOS, 512MB, 133/166MHZ, 66 PIN TSOP II. FREE 2 YEAR RADWELL WARRANTY

Suppliers

Company
Product
Description
Supplier Links
Memory IC - 133576398 - Radwell International
Willingboro, NJ, United States
Memory IC
133576398
Memory IC 133576398
DISCONTINUED BY MANUFACTURER, DDR1 DRAM, 32MX16, 0.7NS, CMOS, 512MB, 133/166MHZ, 66 PIN TSOP II. FREE 2 YEAR RADWELL WARRANTY

DISCONTINUED BY MANUFACTURER, DDR1 DRAM, 32MX16, 0.7NS, CMOS, 512MB, 133/166MHZ, 66 PIN TSOP II. FREE 2 YEAR RADWELL WARRANTY

Supplier's Site

Technical Specifications

  Radwell International
Product Category Memory Chips
Product Number 133576398
Product Name Memory IC
Memory Category DRAM Chip
Unlock Full Specs
to access all available technical data

Similar Products

Memory IC and Storage Component - 774-NMC2148HJ-2 - ERSAELECTRONICS PTE. LTD.
Specs
Memory Category Volatile; SRAM Chip
Access Time 45 ns
Operating Temperature 0 to 70 C (32 to 158 F)
View Details
4 suppliers
Memories - Radiation hardened and high-reliability memories - Space Memories - 5962R1821502VXF - 5962R1821502VXF - Infineon Technologies AG
Specs
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 144000 kbits
Number of Words 4 k
View Details
Flash Memory - 1712234P - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category Flash
Density 64000 kbits
Package Type SOIC; SOIC
View Details
Memory - SMJ626162 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category SDRAM; DRAM Chip
Access Time 12 ns
Operating Temperature -65 to 150 C (-85 to 302 F)
View Details