Due to its low ESL characteristics, the products can be used as decoupling capacitors to supply current to the high-speed application processors (APs) of mobile devices (smartphones, tablet PCs) efficiently and stably.
The products are embedded inside substrates to correspond to devices or modules, securing mounting space. In addition, they help remove high-frequency noise, suffering less effects from external environmental stress.
General Features
Low ESL, Enhancing adhesive strength to epoxy
Various thickness 0.11mm ~ 0.33mm, Temperature range -55℃ to +85℃, Case size 0603 to 1005
Application
FCBGA for application processor, PMIC module, Wearable devices
Why Samsung
Features of Products (Technology)
Has a ceramic body surface and a plating surface to maintain strong adhesion to epoxy while being embedded
Has a flat plating surface layer to secure stable adhesion to the fixing tape in the substrate laminating process while being embedded
Has low ESL values to remove high-frequency noise and through structural design, Reverse-type embedded LICCs with lower ESL values are also provided.
Sectional View
Has Cu plating for the external electrode and is thin in terms of thickness
Type
Dimension(220nF)
Embedded MLCC
Length (L,mm)
Width (W,mm)
Thickness (T,mm)
Band Width (BW,mm)
1.0±0.05
0.5±0.05
0.2375±0.0125
0.26 ~ 0.45
Embedded LICC
Length (L,mm)
Width (W,mm)
Thickness (T,mm)
Band Width (BW,mm)
0.6±0.04
1.0±0.04
0.165±0.015
0.165 ~ 0.265
Due to its low ESL characteristics, the products can be used as decoupling capacitors to supply current to the high-speed application processors (APs) of mobile devices (smartphones, tablet PCs) efficiently and stably.
The products are embedded inside substrates to correspond to devices or modules, securing mounting space. In addition, they help remove high-frequency noise, suffering less effects from external environmental stress.
General Features
- Low ESL, Enhancing adhesive strength to epoxy
- Various thickness 0.11mm ~ 0.33mm, Temperature range -55℃ to +85℃, Case size 0603 to 1005
Application
- FCBGA for application processor, PMIC module, Wearable devices
Why Samsung
Features of Products (Technology)
- Has a ceramic body surface and a plating surface to maintain strong adhesion to epoxy while being embedded
- Has a flat plating surface layer to secure stable adhesion to the fixing tape in the substrate laminating process while being embedded
- Has low ESL values to remove high-frequency noise and through structural design, Reverse-type embedded LICCs with lower ESL values are also provided.
Sectional View
Has Cu plating for the external electrode and is thin in terms of thickness
| Type | | | Dimension(220nF) |
|---|
Embedded
MLCC | | |
Length
(L,mm) | Width
(W,mm) | Thickness
(T,mm) | Band Width
(BW,mm) |
|---|
| 1.0±0.05 | 0.5±0.05 | 0.2375±0.0125 | 0.26 ~ 0.45 |
|
|---|
Embedded
LICC | | |
Length
(L,mm) | Width
(W,mm) | Thickness
(T,mm) | Band Width
(BW,mm) |
|---|
| 0.6±0.04 | 1.0±0.04 | 0.165±0.015 | 0.165 ~ 0.265 |
|
|---|
