Saint-Gobain Surface Conditioning Group ABC Metal Bond Saw Grit Diamond SG 55

Metal bond saw grit diamond has extremely high strength, low metallic inclusions, excellent thermal stability and controlled shape. This diamond type is intended for use in tough cutting environments. Features: Metal bond saw grit diamond is typically 40µm and larger in particle size.

Metal bond diamond is a synthetic material, grown slowly compared to resin bond diamond, resulting in monocrystalline structures with high toughness. The typical blocky crystals are suitable for resin, metal and electroplated bond systems. Features Metal bond mesh diamond is typically 40µm and larger in particle size and is available in standard electroless nickel (Ni) coatings of 30% and 56% by weight, and a copper (Cu) coating of 50% by weight. Electroless coated particles promote enhanced grinding wheel performance in terms of longevity due to improved heat removal from the grinding zone and increased abrasive adhesion in the bond system.