Saint-Gobain Surface Conditioning Group Warren Resin Bond Micron RB Micron

Description
Resin bond micron diamond is a synthetic material with a friable crystal structure intended for use in vitrified and resin bond systems. Crystals are irregular, elongated, rough edged and are suitable for grinding tungsten carbide, ceramics and glasses. The friability or breakdown characteristics of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. During grinding, grains are microfractured and new edges formed enabling an efficient, free cutting action. Features: Resin bond micron diamond is typically 40µm and smaller in particle size and is available in standard electroless nickel (Ni) and copper (Cu) coatings.
Description
Resin bond micron diamond is a synthetic material with a friable crystal structure intended for use in vitrified and resin bond systems. Crystals are irregular, elongated, rough edged and are suitable for grinding tungsten carbide, ceramics and glasses. The friability or breakdown characteristics of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. During grinding, grains are microfractured and new edges formed enabling an efficient, free cutting action. Features: Resin bond micron diamond is typically 40µm and smaller in particle size and is available in standard electroless nickel (Ni) and copper (Cu) coatings.

Suppliers

Company
Product
Description
Supplier Links
Warren Resin Bond Micron - RB Micron - Saint-Gobain Surface Conditioning Group
Anaheim, CA, USA
Warren Resin Bond Micron
RB Micron
Warren Resin Bond Micron RB Micron
Resin bond micron diamond is a synthetic material with a friable crystal structure intended for use in vitrified and resin bond systems. Crystals are irregular, elongated, rough edged and are suitable for grinding tungsten carbide, ceramics and glasses. The friability or breakdown characteristics of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. During grinding, grains are microfractured and new edges formed enabling an efficient, free cutting action. Features: Resin bond micron diamond is typically 40µm and smaller in particle size and is available in standard electroless nickel (Ni) and copper (Cu) coatings.

Resin bond micron diamond is a synthetic material with a friable crystal structure intended for use in vitrified and resin bond systems. Crystals are irregular, elongated, rough edged and are suitable for grinding tungsten carbide, ceramics and glasses. The friability or breakdown characteristics of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. During grinding, grains are microfractured and new edges formed enabling an efficient, free cutting action.

Features:

Resin bond micron diamond is typically 40µm and smaller in particle size and is available in standard electroless nickel (Ni) and copper (Cu) coatings.

Supplier's Site
ABC Micron RB Micron
Resin bond micron diamond is a synthetic material with a friable crystal structure intended for use in vitrified and resin bond systems. Crystals are irregular, elongated, rough edged and are suitable for grinding tungsten carbide, ceramics and glasses. The friability or breakdown characteristics of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. During grinding, grains are microfractured and new edges formed enabling an efficient, free cutting action. Features: Resin bond micron diamond is typically 40µm and smaller in particle size and is available in standard electroless nickel (Ni) and copper (Cu) coatings.

Resin bond micron diamond is a synthetic material with a friable crystal structure intended for use in vitrified and resin bond systems. Crystals are irregular, elongated, rough edged and are suitable for grinding tungsten carbide, ceramics and glasses. The friability or breakdown characteristics of the diamond is a function of its polycrystalline structure and metallic inclusions within the grains. During grinding, grains are microfractured and new edges formed enabling an efficient, free cutting action.

Features:

Resin bond micron diamond is typically 40µm and smaller in particle size and is available in standard electroless nickel (Ni) and copper (Cu) coatings.

Supplier's Site

Technical Specifications

  Saint-Gobain Surface Conditioning Group
Product Category Ceramic Media and Abrasives
Product Number RB Micron
Product Name Warren Resin Bond Micron
Type / Shape Abrasive Grain / Grit
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