ROHM Semiconductor USA, LLC Connectors,Interconnects MCR18ERTJ220

Description
Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Connectors,Interconn ects Resistance: 100(ohm) Composition: Wirewound Temperature Coefficient: ±1200ppm/°C Operating Temperature: -40°C ~ 85°C Package / Case: 41-PowerBQFN Module Supplier Device Package: 529-MAPBGA (19x19) Size / Dimension: 0.335" Dia x 0.315" H (8.50mm x 8.00mm) Height - Seated (Max): 0.228" (5.80mm)
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Description
Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Connectors,Interconn ects Resistance: 100(ohm) Composition: Wirewound Temperature Coefficient: ±1200ppm/°C Operating Temperature: -40°C ~ 85°C Package / Case: 41-PowerBQFN Module Supplier Device Package: 529-MAPBGA (19x19) Size / Dimension: 0.335" Dia x 0.315" H (8.50mm x 8.00mm) Height - Seated (Max): 0.228" (5.80mm)
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Suppliers

Company
Product
Description
Supplier Links
Connectors,Interconnects -  - Win Source Electronics
Laguna Hills, CA, United States
Connectors,Interconnects
Connectors,Interconnects
Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Connectors,Interconn ects Resistance: 100(ohm) Composition: Wirewound Temperature Coefficient: ±1200ppm/°C Operating Temperature: -40°C ~ 85°C Package / Case: 41-PowerBQFN Module Supplier Device Package: 529-MAPBGA (19x19) Size / Dimension: 0.335" Dia x 0.315" H (8.50mm x 8.00mm) Height - Seated (Max): 0.228" (5.80mm)

Alternative Parts (Cross-Reference): Cross
Manufacturer: AMIS
Category: Connectors,Interconnects
Resistance: 100(ohm)
Composition: Wirewound
Temperature Coefficient: ±1200ppm/°C
Operating Temperature: -40°C ~ 85°C
Package / Case: 41-PowerBQFN Module
Supplier Device Package: 529-MAPBGA (19x19)
Size / Dimension: 0.335" Dia x 0.315" H (8.50mm x 8.00mm)
Height - Seated (Max): 0.228" (5.80mm)

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Technical Specifications

  Win Source Electronics
Product Category Electrical Connectors
Product Name Connectors,Interconnects
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