ROHM Semiconductor GmbH Power Management LSI for Mobile Phone BD7185AGWL

Description
The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- 3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones. The device provides 5-Buck Converters. The device also includes 12 general-purpose LDOs providing a wide range of voltage and current capabilities. All Buck Converters and LDOs are fully controllable by the I2C interface. The BD7185AGWL is very easy to use in any mobile platforms.
  • Power Management LSI for Mobile Phone - BD7185AGWL - ROHM Semiconductor USA, LLC
    ROHM Semiconductor USA, LLC
Datasheet
Description
The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- 3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones. The device provides 5-Buck Converters. The device also includes 12 general-purpose LDOs providing a wide range of voltage and current capabilities. All Buck Converters and LDOs are fully controllable by the I2C interface. The BD7185AGWL is very easy to use in any mobile platforms.
Datasheet

Suppliers

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Power Management LSI for Mobile Phone - BD7185AGWL - ROHM Semiconductor USA, LLC
ROHM Semiconductor USA, LLC
Santa Clara, CA, USA
Power Management LSI for Mobile Phone
BD7185AGWL
Power Management LSI for Mobile Phone BD7185AGWL
The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- 3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones. The device provides 5-Buck Converters. The device also includes 12 general-purpose LDOs providing a wide range of voltage and current capabilities. All Buck Converters and LDOs are fully controllable by the I2C interface. The BD7185AGWL is very easy to use in any mobile platforms.

The BD7185AGWL is an integrated Power Management LSI available in a small 80-pins 0.4mm-pitch 3.8mm-by- 3.8mm Wafer-level CSP package, which is designed to meet demands for space-constrained Smart phones.
The device provides 5-Buck Converters.
The device also includes 12 general-purpose LDOs providing a wide range of voltage and current capabilities.
All Buck Converters and LDOs are fully controllable by the I2C interface. The BD7185AGWL is very easy to use in any mobile platforms.

Supplier's Site Datasheet

Technical Specifications

  ROHM Semiconductor USA, LLC
Product Category IC Switching Voltage Regulators
Product Number BD7185AGWL
Product Name Power Management LSI for Mobile Phone
Package Type Other; UCSP50L3C
Output Voltage 1 to 3.4 volts
IOUT 1 amps
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