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Rigaku Corporation Simultaneous WDXRF Spectrometer WDA-3650

Description
The WDA-3650 X-ray fluorescence spectrometer for thin film evaluation continues Rigaku's 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film thickness, film composition, and element concentration with new functions and a low-COO design. A versatile and reliable tool for 200 mm and smaller wafers, the WDA-3650 incorporates our trademark X-Y-θ sample stage system for superior results on difficult measurements, such as ferrodielectric films. Multiple channels enable simultaneous measurement of multiple elements of interest for high throughput. The high energy resolution of this wavelength-dispersiv e XRF system, compared to energy-dispersive XRF systems, is especially useful to minimize peak overlap when element peaks are closely spaced. For boron applications, the available AD-Boron channel provides 5-times greater sensitivity than previous models. The AutoCal function and built-in internal wafer stocker, previously only available on 300mm tools, enable fully-automated daily tool qualification and intensity calibration. The WDA-3650 is extremely compact with the basic unit requiring less than 1 m2 of valuable cleanroom space, and there is no need for side maintenance service access. Power consumption has been reduced more than 20% compared to the previous model.

Suppliers

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Description
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Simultaneous WDXRF Spectrometer - WDA-3650 - Rigaku Corporation
The Woodlands, TX, USA
Simultaneous WDXRF Spectrometer
WDA-3650
Simultaneous WDXRF Spectrometer WDA-3650
The WDA-3650 X-ray fluorescence spectrometer for thin film evaluation continues Rigaku's 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film thickness, film composition, and element concentration with new functions and a low-COO design. A versatile and reliable tool for 200 mm and smaller wafers, the WDA-3650 incorporates our trademark X-Y-θ sample stage system for superior results on difficult measurements, such as ferrodielectric films. Multiple channels enable simultaneous measurement of multiple elements of interest for high throughput. The high energy resolution of this wavelength-dispersiv e XRF system, compared to energy-dispersive XRF systems, is especially useful to minimize peak overlap when element peaks are closely spaced. For boron applications, the available AD-Boron channel provides 5-times greater sensitivity than previous models. The AutoCal function and built-in internal wafer stocker, previously only available on 300mm tools, enable fully-automated daily tool qualification and intensity calibration. The WDA-3650 is extremely compact with the basic unit requiring less than 1 m2 of valuable cleanroom space, and there is no need for side maintenance service access. Power consumption has been reduced more than 20% compared to the previous model.

The WDA-3650 X-ray fluorescence spectrometer for thin film evaluation continues Rigaku's 30-year history of XRF wafer analyzers that has mirrored the history of thin film device development. This latest XRF metrology tool contributes significantly to the process control of metal film thickness, film composition, and element concentration with new functions and a low-COO design.

A versatile and reliable tool for 200 mm and smaller wafers, the WDA-3650 incorporates our trademark X-Y-θ sample stage system for superior results on difficult measurements, such as ferrodielectric films. Multiple channels enable simultaneous measurement of multiple elements of interest for high throughput. The high energy resolution of this wavelength-dispersive XRF system, compared to energy-dispersive XRF systems, is especially useful to minimize peak overlap when element peaks are closely spaced.

For boron applications, the available AD-Boron channel provides 5-times greater sensitivity than previous models. The AutoCal function and built-in internal wafer stocker, previously only available on 300mm tools, enable fully-automated daily tool qualification and intensity calibration.

The WDA-3650 is extremely compact with the basic unit requiring less than 1 m2 of valuable cleanroom space, and there is no need for side maintenance service access. Power consumption has been reduced more than 20% compared to the previous model.

Supplier's Site

Technical Specifications

  Rigaku Corporation
Product Category Wafer and Thin Film Instrumentation
Product Number WDA-3650
Product Name Simultaneous WDXRF Spectrometer
Form Factor Monitor or instrument
Mounting / Loading Floor
Technology Spectrometer (SIMS, XRF, FTIR, DLTS, AAS); WDXRF
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