Rigaku Corporation In-line, Simultaneous WDXRF Spectrometer WaferX 300

Rigaku's WaferX 300 represents the culmination of 25 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Specifically developed as an in-process metrology tool, the system incorporates "bridge tool" technology — servicing 6", 8", as well as the latest 12" wafers. The WaferX 300 is ideal for measuring BPSG, PSG and metal films. In addition, thin film BPSG, multilayered circuit film, WSix, electrode films, ferrodielectric thin films, FRAM, next generation DRAM, and SiOF are standard applications for this tool. Highly accurate analyses for the ultralight elements such as B and P in BPSG film has been improved significantly by employing a 4kW high power X-ray tube with a super thin window beryllium window. The instrument employs a wafer height adjustment mechanism to compensate for differences in wafer thickness and a diffraction beam removal mechanism to eliminate diffraction interference for the transition metals. Integrated FOUP(SMIF) is available, supporting the C-to-C standard. Various user cassettes can also be loaded. FOUP(SMIF) through-the-wall option is available.