Rigaku Corporation Wafer Surface Contamination Metrology by TXRF TXRF-310

TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-310 can measure elements from Na through U with a single-target, 3-beam X-ray system and a solid-state detector system. The TXRF-310 includes Rigaku's patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant distribution over the wafer surface to identify "hot spots" that can be automatically re-measured at higher precision. Optional ZEE-TXRF capability overcomes the historical 15mm edge exclusion of original TXRF designs, enabling measurements to be made with zero edge exclusion. Optional BAC-TXRF capability enables fully-automated front-side and back-side TXRF measurements of 300mm wafers with non-contacting wafer flipping.