Renesas Electronics Corporation Integrated Circuits (ICs) - Logic - FIFOs Memory 72V3670L6BBG8

Description
PBGA 13.00X13.00X1.76 MM, 1.00MM
Datasheet
Description
PBGA 13.00X13.00X1.76 MM, 1.00MM
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Logic - FIFOs Memory - 72V3670L6BBG8 - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Logic - FIFOs Memory
72V3670L6BBG8
Integrated Circuits (ICs) - Logic - FIFOs Memory 72V3670L6BBG8
PBGA 13.00X13.00X1.76 MM, 1.00MM

PBGA 13.00X13.00X1.76 MM, 1.00MM

Supplier's Site
Logic - FIFOs Memory - 72V3670L6BBG8 - Lingto Electronic Limited
Shenzhen, China
Logic - FIFOs Memory
72V3670L6BBG8
Logic - FIFOs Memory 72V3670L6BBG8
PBGA 13.00X13.00X1.76 MM, 1.00MM

PBGA 13.00X13.00X1.76 MM, 1.00MM

Supplier's Site Datasheet
FIFOs Memory - 72V3670L6BBG8 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
FIFOs Memory
72V3670L6BBG8
FIFOs Memory 72V3670L6BBG8
Synchronous FIFO 288K (8K x 36) Uni-Directional 166MHz 4ns 144-PBGA (13x13)

Synchronous FIFO 288K (8K x 36) Uni-Directional 166MHz 4ns 144-PBGA (13x13)

Buy Now Datasheet

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips
Product Number 72V3670L6BBG8 72V3670L6BBG8 72V3670L6BBG8
Product Name Integrated Circuits (ICs) - Logic - FIFOs Memory Logic - FIFOs Memory FIFOs Memory
Access Time 4 ns 4 ns 4 ns
Operating Temperature 0 to 70 C (32 to 158 F) 0 to 70 C (32 to 158 F)
Density 288 kbits 288 kbits
Package Type BGA BGA; 144-BGA
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