Renesas Electronics Corporation Integrated Circuits (ICs) - Logic - FIFOs Memory 7203L30TDB

Description
IC FIFO ASYNC 2KX9 30NS 28CDIP
Description
IC FIFO ASYNC 2KX9 30NS 28CDIP
Datasheet
Datasheet Summary
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The IDT7203L30TDB is a CMOS asynchronous FIFO memory with a 2,048 x 9 organization, designed for high-speed applications with a maximum access time of 30 ns. It features dual-port architecture, allowing simultaneous read and write operations, which is beneficial for multiprocessing and rate buffering applications. The device operates with a maximum active power consumption of 660 mW and a power-down mode consumption of 44 mW, making it suitable for low-power applications. This FIFO memory includes status flags for empty, half-full, and full conditions, as well as a retransmit capability that allows the read pointer to reset. It is fully expandable in both word depth and width, and is compatible with other members of the 720x family, providing flexibility in design. The IDT7203L30TDB is compliant with military specifications (MIL-STD-883, Class B) and is available in various package types, including plastic DIP and thin DIP. The operational temperature range for this device is from -40¬8C to +85¬8C for industrial applications, and it is also available in military grade with a temperature range of -55¬8C to +125¬8C.

Datasheet Summary
Powered by GS/AI

The IDT7203L30TDB is a CMOS asynchronous FIFO memory with a 2,048 x 9 organization, designed for high-speed applications with a maximum access time of 30 ns. It features dual-port architecture, allowing simultaneous read and write operations, which is beneficial for multiprocessing and rate buffering applications. The device operates with a maximum active power consumption of 660 mW and a power-down mode consumption of 44 mW, making it suitable for low-power applications. This FIFO memory includes status flags for empty, half-full, and full conditions, as well as a retransmit capability that allows the read pointer to reset. It is fully expandable in both word depth and width, and is compatible with other members of the 720x family, providing flexibility in design. The IDT7203L30TDB is compliant with military specifications (MIL-STD-883, Class B) and is available in various package types, including plastic DIP and thin DIP. The operational temperature range for this device is from -40¬8C to +85¬8C for industrial applications, and it is also available in military grade with a temperature range of -55¬8C to +125¬8C.

Suppliers

Company
Product
Description
Supplier Links
Futian, China
Integrated Circuits (ICs) - Logic - FIFOs Memory
7203L30TDB
Integrated Circuits (ICs) - Logic - FIFOs Memory 7203L30TDB
IC FIFO ASYNC 2KX9 30NS 28CDIP

IC FIFO ASYNC 2KX9 30NS 28CDIP

Supplier's Site
Logic - FIFOs Memory - 7203L30TDB - Lingto Electronic Limited
Shenzhen, China
Logic - FIFOs Memory
7203L30TDB
Logic - FIFOs Memory 7203L30TDB
IC MEM FIFO 2048X9 20NS 28CDIP

IC MEM FIFO 2048X9 20NS 28CDIP

Supplier's Site Datasheet
FIFOs Memory - 7203L30TDB - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
FIFOs Memory
7203L30TDB
FIFOs Memory 7203L30TDB
Asynchronous FIFO 18K (2K x 9) Uni-Directional 25MHz 30ns 28-CDIP

Asynchronous FIFO 18K (2K x 9) Uni-Directional 25MHz 30ns 28-CDIP

Buy Now Datasheet

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips
Product Number 7203L30TDB 7203L30TDB 7203L30TDB
Product Name Integrated Circuits (ICs) - Logic - FIFOs Memory Logic - FIFOs Memory FIFOs Memory
Access Time 30 ns 30 ns 30 ns
Operating Temperature -55 to 125 C (-67 to 257 F) -55 to 125 C (-67 to 257 F)
Density 18 kbits 18 kbits
Supply Voltage 4.5 V ~ 5.5 V 4.5 V ~ 5.5 V
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