Raytech Gels Potting Compounds Barney

Description
BARNEY - MINI JOINT IP68/IP69 w. 2x2,5 m
Request a Quote
Description
BARNEY - MINI JOINT IP68/IP69 w. 2x2,5 m
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Potting Compounds - 1831668 - RS Components, Ltd.
Corby, Northants, United Kingdom
Potting Compounds
1831668
Potting Compounds 1831668
BARNEY - MINI JOINT IP68/IP69 w. 2x2,5 m

BARNEY - MINI JOINT IP68/IP69 w. 2x2,5 m

Supplier's Site

Technical Specifications

  RS Components, Ltd.
Product Category Industrial Sealants
Product Number 1831668
Product Name Potting Compounds
Features Encapsulant, Potting Compound
Unlock Full Specs
to access all available technical data

Similar Products

One Part, Toughened Epoxy for Dam-and-Fill Encapsulation - Supreme 3DM-85 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
View Details
C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details
KM 2740 Series -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details