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Description

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Shenzhen, Guangdong, China

Memory
MEM-DR464L-CL02-ER32-C

Memory MEM-DR464L-CL02-ER32-C

Memory IC

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Technical Specifications

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Micross Components, Inc.

Specs

Memory Category SDRAM; DRAM Chip

Operating Temperature -55 to 125 C (-67 to 257 F)

Density 32000 kbits

$Memory IC and Storage Component - 505-258217\HYS72T256000HR-5-A - ERSAELECTRONICS PTE. LTD.$

Infineon Technologies AG

Rochester Electronics

Specs

Memory Category SRAM; SRAM Chip

Access Time 35 ns

Density 256 kbits

Texas Instruments

Specs

Memory Category FIFO

Package Type SOIC

6 suppliers