Panasonic Thermal Pad, Graphite, 150X150X0.5Mm; Thickness Panasonic EYG-TF0F0A05A

Description
THERMAL PAD, GRAPHITE, 150X150X0.5MM; Thickness:0.5mm; Conductive Material:Graphite Sheet; Thermal Conductivity:13W/m.K ; Thermal Impedance:-; Volume Resistivity:400000oh m-cm; External Length:150mm; External Width:150mm RoHS Compliant: Yes
Datasheet
Description
THERMAL PAD, GRAPHITE, 150X150X0.5MM; Thickness:0.5mm; Conductive Material:Graphite Sheet; Thermal Conductivity:13W/m.K ; Thermal Impedance:-; Volume Resistivity:400000oh m-cm; External Length:150mm; External Width:150mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, Graphite, 150X150X0.5Mm; Thickness Panasonic - 39AH7157 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, Graphite, 150X150X0.5Mm; Thickness Panasonic
39AH7157
Thermal Pad, Graphite, 150X150X0.5Mm; Thickness Panasonic 39AH7157
THERMAL PAD, GRAPHITE, 150X150X0.5MM; Thickness:0.5mm; Conductive Material:Graphite Sheet; Thermal Conductivity:13W/m.K ; Thermal Impedance:-; Volume Resistivity:400000oh m-cm; External Length:150mm; External Width:150mm RoHS Compliant: Yes

THERMAL PAD, GRAPHITE, 150X150X0.5MM; Thickness:0.5mm; Conductive Material:Graphite Sheet; Thermal Conductivity:13W/m.K; Thermal Impedance:-; Volume Resistivity:400000ohm-cm; External Length:150mm; External Width:150mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 39AH7157
Product Name Thermal Pad, Graphite, 150X150X0.5Mm; Thickness Panasonic
Thermal Conductivity 13 W/m-K (7.51 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-99 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests - EP46HT-2AO Black - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details