Panasonic Thermal Pad, Graphite, 140X140X3Mm; Thickness Panasonic EYG-TE0E0A30A

Description
THERMAL PAD, GRAPHITE, 140X140X3MM; Thickness:3mm; Conductive Material:Graphite Sheet; Thermal Conductivity:13W/m.K ; Thermal Impedance:-; Volume Resistivity:400000oh m-cm; External Length:140mm; External Width:140mm RoHS Compliant: Yes
Datasheet
Description
THERMAL PAD, GRAPHITE, 140X140X3MM; Thickness:3mm; Conductive Material:Graphite Sheet; Thermal Conductivity:13W/m.K ; Thermal Impedance:-; Volume Resistivity:400000oh m-cm; External Length:140mm; External Width:140mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, Graphite, 140X140X3Mm; Thickness Panasonic - 39AH7156 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, Graphite, 140X140X3Mm; Thickness Panasonic
39AH7156
Thermal Pad, Graphite, 140X140X3Mm; Thickness Panasonic 39AH7156
THERMAL PAD, GRAPHITE, 140X140X3MM; Thickness:3mm; Conductive Material:Graphite Sheet; Thermal Conductivity:13W/m.K ; Thermal Impedance:-; Volume Resistivity:400000oh m-cm; External Length:140mm; External Width:140mm RoHS Compliant: Yes

THERMAL PAD, GRAPHITE, 140X140X3MM; Thickness:3mm; Conductive Material:Graphite Sheet; Thermal Conductivity:13W/m.K; Thermal Impedance:-; Volume Resistivity:400000ohm-cm; External Length:140mm; External Width:140mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 39AH7156
Product Name Thermal Pad, Graphite, 140X140X3Mm; Thickness Panasonic
Thermal Conductivity 13 W/m-K (7.51 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
One Part, NASA Low Outgassing Electrically Conductive Epoxy - EP3HTS-LO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Chemical System Epoxy
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details