Palomar Technologies, Inc Vacuum Pressure Furnace SST 518

Overview The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas. The 518 benefits include: Precise control of soldering process profile Consistent, highly reliable solder interface Accurate control of thermal cycles Ease of use and flexibility of operation Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. Flux Free Solder Process Development Assembly of High Reliability Microelectronic Packages Hybrid Microelectronic Circuit Assembly Fiber Optic Package Assembly Ceramic Package Sealing Features Cooling water chiller and pump Multiple point temperature recording Formic acid Flux trap Monitoring thermocouplers Moisture analyzer Oxygen analyzer Plotted profile charts Offline programming Applications Accelerometers Atomic clocks Automotive diodes Automotive sensors CPV solar cell modules Fiber optic devices Flip chips GaN MMICs Gated light arrays Glass diodes Glass-to-metal seals Hearing aid amplifiers Hermetic feed-throughs High accuracy gyroscopes Implantable medical devices Laser pump diodes LED lamps and heaters MEMS devices Microwave packages