The CMI760 PCB Thru-Hole and Copper Thickness Gauge from Hitachi High-Tech America is designed for precise measurement of copper thickness in various PCB applications, including surface and thru-hole measurements. It features dual technology, utilizing both micro-resistance and eddy current methods, which allows for accurate readings on multi-layer boards and various copper types, including tin and tin/lead resist. The gauge comes standard with the SRP-4 probe, which has user-replaceable tips for convenience and durability. An optional ETP probe is available for enhanced eddy current measurements, providing temperature compensation for immediate readings after plating. The device includes a large backlit LCD display with statistical analysis capabilities, including standard deviation and mean calculations, as well as various unit selections for measurement. With a thickness measurement range of 1-102 µm for thru-hole copper and 0.25-254 µm for surface copper, the CMI760 is suitable for a wide range of PCB manufacturing needs. It is A2LA certified for coating thickness calibrations, ensuring compliance with ISO 17025 standards. The compact design and lightweight build make it suitable for both benchtop and field applications.
The CMI760 PCB Thru-Hole & Copper Surface Measurement Gauge is a benchtop coating thickness gauge that is specifically designed for PCB electronics manufacturers.
Highly versatile, the CMI760 coating thickness gauge is designed for those applications that require quick, easy, accurate and repeatable thru-hole measurements on PCB boards as well as measurements of copper plating on rigid, flexible, single and double-sided or multi-layer PCB boards.
| Hitachi High-Tech America | |
|---|---|
| Product Category | Dimensional Gages and Instruments |
| Product Number | CMI760 |
| Product Name | PCB Thru-Hole and Copper Thickness Gauge |
| Mounting / Loading Options | Handheld or Portable; Benchtop or Floor |
