Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation during assembly. The compressibility of the material improves surface contact, reducing thermal impedance. The material compression can compensate for flatness variations of up to 125μm. The high in-plane thermal conductivity of this material reduces hot spots.
Ohmite’s high performance TIMs are designed for long life applications with extreme heat cycles and are made of flexible graphite specifically engineered for demanding power electronics applications.
Features
Consistent, reliable thermal performance enabling zero maintenance applications
Will not low or pump out under any thermal extremes, thermal cycles, power again and power cycling or part orientation
No degradation in performance from initial install and over the life of the application, reducing PM and improving MTTF
Assembly-ready foil form factor eliminates dispensing and cleaning processes
Easy installation removes the need for Burn-in or re-torque, enabling a single step install
Minimal outgassing prevents fouling of optics in lighting applications
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation during assembly. The compressibility of the material improves surface contact, reducing thermal impedance. The material compression can compensate for flatness variations of up to 125μm. The high in-plane thermal conductivity of this material reduces hot spots.
Ohmite’s high performance TIMs are designed for long life applications with extreme heat cycles and are made of flexible graphite specifically engineered for demanding power electronics applications.
Features
- Consistent, reliable thermal performance enabling zero maintenance applications
- Will not low or pump out under any thermal extremes, thermal cycles, power again and power cycling or part orientation
- No degradation in performance from initial install and over the life of the application, reducing PM and improving MTTF
- Assembly-ready foil form factor eliminates dispensing and cleaning processes
- Easy installation removes the need for Burn-in or re-torque, enabling a single step install
- Minimal outgassing prevents fouling of optics in lighting applications
