Ohmite introduces the M series, patented (Pat. No. 7,151,669), high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest surface area and smallest footprint. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling.
Heat Sink TO-247, TO-264 Aluminum Top Mount
| Richardson RFPD | DigiKey | |
|---|---|---|
| Product Category | Heat Sinks | Heat Sinks |
| Product Number | MV-301-27E | MV-301-27E-ND |
| Product Name | Board Level Heat Sink | Heat Sinks |
| H | 34.04 mm (1.34 inch) | |
| Device | Passive Heat Sink | |
| Weight | 65.19 g (2.3 oz) |
