Ohmite Manufacturing Co. Heatsink For TO-252, TO-263 and TO-268 Devices D Series

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Heatsink For TO-252, TO-263 and TO-268 Devices - D Series - Ohmite Manufacturing Co.
Warrenville, IL, United States
Heatsink For TO-252, TO-263 and TO-268 Devices D Series
These surfacemount heatsinks are extruded not stamped. This extruded designs are far more efficient than any stamped counterpart. One of the main issues is getting heat from the board level into the heatsink. The extrusion allow for large pads and a direct thermal path from the board and into the heatsink. The ability to get the heat off the board coupled with its large surface area yields a surfacemount heatsink unmatched in the market. Extruded heat sink body Compatible with TO-263 and TO-268 SMD devices Increased surface area over standard stamped heatsinks For use with Ohmite TDH35 series
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Technical Specifications

  Ohmite Manufacturing Co.
Product Category Heat Sinks
Product Number D Series
Product Name Heatsink For TO-252, TO-263 and TO-268 Devices
Mounting Tinn Plated, Solderable Rods with an Aluminum Extruded Heat Sink Body.
Device Passive Heat Sink
W 25.9 to 40.2 mm (1.02 to 1.58 inch)
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