NTE Electronics, Inc. Thermal Insulators, Thermo Pad, To-3; Insulator Body Material Nte Electronics TP0001

Description
THERMAL INSULATORS, THERMO PAD, TO-3; Insulator Body Material:Fibreglass, Silicone Elastomer; Thermal Conductivity:0.9W/m. K; Breakdown Voltage Vbr:4.5kV; Thickness:0.229mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.45°C/W RoHS Compliant: Yes
  • Thermal Insulators, Thermo Pad, To-3; Insulator Body Material Nte Electronics - 79M5626 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL INSULATORS, THERMO PAD, TO-3; Insulator Body Material:Fibreglass, Silicone Elastomer; Thermal Conductivity:0.9W/m. K; Breakdown Voltage Vbr:4.5kV; Thickness:0.229mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.45°C/W RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Insulators, Thermo Pad, To-3; Insulator Body Material Nte Electronics - 79M5626 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Insulators, Thermo Pad, To-3; Insulator Body Material Nte Electronics
79M5626
Thermal Insulators, Thermo Pad, To-3; Insulator Body Material Nte Electronics 79M5626
THERMAL INSULATORS, THERMO PAD, TO-3; Insulator Body Material:Fibreglass, Silicone Elastomer; Thermal Conductivity:0.9W/m. K; Breakdown Voltage Vbr:4.5kV; Thickness:0.229mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.45°C/W RoHS Compliant: Yes

THERMAL INSULATORS, THERMO PAD, TO-3; Insulator Body Material:Fibreglass, Silicone Elastomer; Thermal Conductivity:0.9W/m.K; Breakdown Voltage Vbr:4.5kV; Thickness:0.229mm; Volume Resistivity:10ohm-m; Thermal Impedance:1.45°C/W RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 79M5626
Product Name Thermal Insulators, Thermo Pad, To-3; Insulator Body Material Nte Electronics
Thermal Conductivity 0.9000 W/m-K (0.5200 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-85 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-85
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - Dissipator 745
745PT
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
High-Performance Carbon Fiber Thermal Conductive Pad for Mass Storage Devices - CSF20 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High-Performance Carbon Fiber Thermal Conductive Pad for Mass Storage Devices
CSF20
Specs
Form / Shape Pad
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details