NTE Electronics, Inc. Heat Sink Compound, Non-Silicone, 1Oz, Tube; Dispensing Method Nte Electronics NTE424

Description

HEAT SINK COMPOUND, NON-SILICONE, 1OZ, TUBE; Dispensing Method:Tube; Volume:-; Weight:1oz; Product Range:- RoHS Compliant: Yes

Newark, An Avnet Company

Datasheet

Description

HEAT SINK COMPOUND, NON-SILICONE, 1OZ, TUBE; Dispensing Method:Tube; Volume:-; Weight:1oz; Product Range:- RoHS Compliant: Yes

Datasheet

Suppliers

Company

Product

Description

Supplier Links

Newark, An Avnet Company

Chicago, IL, United States

Heat Sink Compound, Non-Silicone, 1Oz, Tube; Dispensing Method Nte Electronics
31C4127

Heat Sink Compound, Non-Silicone, 1Oz, Tube; Dispensing Method Nte Electronics 31C4127

HEAT SINK COMPOUND, NON-SILICONE, 1OZ, TUBE; Dispensing Method:Tube; Volume:-; Weight:1oz; Product Range:- RoHS Compliant: Yes

Supplier's Site

Datasheet

Technical Specifications

	Newark, An Avnet Company
Product Category	Thermal Compounds and Thermal Interface Materials
Product Number	31C4127
Product Name	Heat Sink Compound, Non-Silicone, 1Oz, Tube; Dispensing Method Nte Electronics

Unlock Full Specs

to access all available technical data

Similar Products

Quantaflex Printed Electronics Inc.

Thermal Interface Materials

Specs

Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket

Industry Electronics; Semiconductors, IC's

Features EMI/RFI Shielding

View Details

RS Components, Ltd.

Thermal Pads

607026

Specs

Thermal Conductivity 9 W/m-K (5.2 BTU-ft/hr-ft²-F)

View Details

Hernon Manufacturing, Inc.

Formulations - Applications - Thermally Conductive - Dissipator 745

745PT

Specs

Cure / Technology Room Temperature Vulcanizing or Curing

Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

View Details

MacDermid Alpha Electronics Solutions

ATROX ® 590-4HT1

Specs

Form / Shape Die Bonding Adhesives

Composition Filled

Industry Electronics; Semiconductors, IC's

View Details