Nordson EFD Thermal Compound TC70-57000

Description
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and cooling cycles (so called pump-out), create voids, and lose effectiveness, leading to overheating of electronic components and premature product failure. The synthetic-based, silicone-free thermal greases found in EFD thermal compounds make them suitable for use in the electronic, automotive, and electrical industries. Features & Benefits Excellent heat transfer Good wetting Low bond line Low thermal resistance High thermal conductivity (high bulk thermal conductivity) for thick-film and gap-fill applications Non-silicone Does not dry out Resists spreading / pump-out Long, reliable performance Water cleanable for easy use and clean-up Dispense from syringe barrels with hand plungers, or with Nordson EFD’s electro-pneumatic dispensers High dielectric strength Long shelf-life stability RoHS and REACH compliant Lead-free EFD's thermal compounds are formulated to virtually eliminate pump-out, ensuring long-lasting thermal management and effective heat transfer. The long-term material stability of our compounds guarantees they will not leach, dry, harden, or melt in normal industrial conditions.
Description
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and cooling cycles (so called pump-out), create voids, and lose effectiveness, leading to overheating of electronic components and premature product failure. The synthetic-based, silicone-free thermal greases found in EFD thermal compounds make them suitable for use in the electronic, automotive, and electrical industries. Features & Benefits Excellent heat transfer Good wetting Low bond line Low thermal resistance High thermal conductivity (high bulk thermal conductivity) for thick-film and gap-fill applications Non-silicone Does not dry out Resists spreading / pump-out Long, reliable performance Water cleanable for easy use and clean-up Dispense from syringe barrels with hand plungers, or with Nordson EFD’s electro-pneumatic dispensers High dielectric strength Long shelf-life stability RoHS and REACH compliant Lead-free EFD's thermal compounds are formulated to virtually eliminate pump-out, ensuring long-lasting thermal management and effective heat transfer. The long-term material stability of our compounds guarantees they will not leach, dry, harden, or melt in normal industrial conditions.

Suppliers

Company
Product
Description
Supplier Links
Thermal Compound - TC70-57000 - Nordson EFD
East Providence, RI, USA
Thermal Compound
TC70-57000
Thermal Compound TC70-57000
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and cooling cycles (so called pump-out), create voids, and lose effectiveness, leading to overheating of electronic components and premature product failure. The synthetic-based, silicone-free thermal greases found in EFD thermal compounds make them suitable for use in the electronic, automotive, and electrical industries. Features & Benefits Excellent heat transfer Good wetting Low bond line Low thermal resistance High thermal conductivity (high bulk thermal conductivity) for thick-film and gap-fill applications Non-silicone Does not dry out Resists spreading / pump-out Long, reliable performance Water cleanable for easy use and clean-up Dispense from syringe barrels with hand plungers, or with Nordson EFD’s electro-pneumatic dispensers High dielectric strength Long shelf-life stability RoHS and REACH compliant Lead-free EFD's thermal compounds are formulated to virtually eliminate pump-out, ensuring long-lasting thermal management and effective heat transfer. The long-term material stability of our compounds guarantees they will not leach, dry, harden, or melt in normal industrial conditions.

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials.

Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and cooling cycles (so called pump-out), create voids, and lose effectiveness, leading to overheating of electronic components and premature product failure.

The synthetic-based, silicone-free thermal greases found in EFD thermal compounds make them suitable for use in the electronic, automotive, and electrical industries.

Features & Benefits

  • Excellent heat transfer
    • Good wetting
    • Low bond line
    • Low thermal resistance
    • High thermal conductivity (high bulk thermal conductivity) for thick-film and gap-fill applications
  • Non-silicone
    • Does not dry out
    • Resists spreading / pump-out
    • Long, reliable performance
  • Water cleanable for easy use and clean-up
  • Dispense from syringe barrels with hand plungers, or with Nordson EFD’s electro-pneumatic dispensers
  • High dielectric strength
  • Long shelf-life stability
  • RoHS and REACH compliant
  • Lead-free

EFD's thermal compounds are formulated to virtually eliminate pump-out, ensuring long-lasting thermal management and effective heat transfer.

The long-term material stability of our compounds guarantees they will not leach, dry, harden, or melt in normal industrial conditions.

Supplier's Site

Technical Specifications

  Nordson EFD
Product Category Thermal Compounds and Thermal Interface Materials
Product Number TC70-57000
Product Name Thermal Compound
Cure / Technology Single Component
Form / Shape Grease, Paste
Composition Unfilled
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