Nexperia B.V. 20 V, P-channel Trench MOSFET PMXB75UPEX

Description
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. Features and benefits Trench MOSFET technology Leadless ultra small and ultra thin SMD plastic package: 1.1 × 1.0 × 0.37 mm Exposed drain pad for excellent thermal conduction ElectroStatic Discharge (ESD) protection 1.5 kV HBM Drain-source on-state resistance RDSon = 69 mΩ Very low gate-source threshold voltage for portable applications VGS(th) = -0.68 V Applications High-side load switch and charging switch for portable devices Power management in battery driven portables LED driver DC-to-DC converter
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Description
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. Features and benefits Trench MOSFET technology Leadless ultra small and ultra thin SMD plastic package: 1.1 × 1.0 × 0.37 mm Exposed drain pad for excellent thermal conduction ElectroStatic Discharge (ESD) protection 1.5 kV HBM Drain-source on-state resistance RDSon = 69 mΩ Very low gate-source threshold voltage for portable applications VGS(th) = -0.68 V Applications High-side load switch and charging switch for portable devices Power management in battery driven portables LED driver DC-to-DC converter
Request a Quote Datasheet

Suppliers

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Supplier Links
20 V, P-channel Trench MOSFET - PMXB75UPEX - Nexperia B.V.
Nijmegen, Netherlands
20 V, P-channel Trench MOSFET
PMXB75UPEX
20 V, P-channel Trench MOSFET PMXB75UPEX
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. Features and benefits Trench MOSFET technology Leadless ultra small and ultra thin SMD plastic package: 1.1 × 1.0 × 0.37 mm Exposed drain pad for excellent thermal conduction ElectroStatic Discharge (ESD) protection 1.5 kV HBM Drain-source on-state resistance RDSon = 69 mΩ Very low gate-source threshold voltage for portable applications VGS(th) = -0.68 V Applications High-side load switch and charging switch for portable devices Power management in battery driven portables LED driver DC-to-DC converter

P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

Features and benefits

  • Trench MOSFET technology
  • Leadless ultra small and ultra thin SMD plastic package: 1.1 × 1.0 × 0.37 mm
  • Exposed drain pad for excellent thermal conduction
  • ElectroStatic Discharge (ESD) protection 1.5 kV HBM
  • Drain-source on-state resistance RDSon = 69 mΩ
  • Very low gate-source threshold voltage for portable applications VGS(th) = -0.68 V

Applications

  • High-side load switch and charging switch for portable devices
  • Power management in battery driven portables
  • LED driver
  • DC-to-DC converter
Supplier's Site Datasheet

Technical Specifications

  Nexperia B.V.
Product Category Metal-Oxide Semiconductor FET (MOSFET)
Product Number PMXB75UPEX
Product Name 20 V, P-channel Trench MOSFET
Polarity P-Channel
MOSFET Operating Mode Enhancement
V(BR)DSS -20 volts
IDSS -2900 milliamps
VGS(off) -0.6800 volts
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