Nexperia B.V. 20 V, single P-channel Trench MOSFET PMPB33XPZ

Description
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. Features and benefits Trench MOSFET technology Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm Exposed drain pad for excellent thermal conduction Tin-plated 100 % solderable side pads for optical solder inspection Applications Charging switch for portable devices DC-to-DC converters Power management in battery-driven portable devices Hard disk and computing power management
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Description
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. Features and benefits Trench MOSFET technology Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm Exposed drain pad for excellent thermal conduction Tin-plated 100 % solderable side pads for optical solder inspection Applications Charging switch for portable devices DC-to-DC converters Power management in battery-driven portable devices Hard disk and computing power management
Request a Quote
Datasheet
Datasheet Summary
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P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology, measuring 2 x 2 x 0.65 mm with an exposed drain pad for thermal conduction. The device is rated for a drain-source voltage of -20 V, a gate-source voltage range of -12 V to 12 V, and a continuous drain current of -5.5 A at 25 °C. It has a typical on-state resistance of 30 mΩ at -4.5 V gate drive and 25 °C, a total power dissipation of 1.7 W at 25 °C, and a junction temperature range of -55 °C to 150 °C. The package features tin-plated side pads for optical solder inspection and is suitable for applications including battery-powered portable devices, DC-to-DC converters, and power management in computing systems.

Datasheet Summary
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P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology, measuring 2 x 2 x 0.65 mm with an exposed drain pad for thermal conduction. The device is rated for a drain-source voltage of -20 V, a gate-source voltage range of -12 V to 12 V, and a continuous drain current of -5.5 A at 25 °C. It has a typical on-state resistance of 30 mΩ at -4.5 V gate drive and 25 °C, a total power dissipation of 1.7 W at 25 °C, and a junction temperature range of -55 °C to 150 °C. The package features tin-plated side pads for optical solder inspection and is suitable for applications including battery-powered portable devices, DC-to-DC converters, and power management in computing systems.

Suppliers

Company
Product
Description
Supplier Links
20 V, single P-channel Trench MOSFET - PMPB33XPZ - Nexperia B.V.
Nijmegen, Netherlands
20 V, single P-channel Trench MOSFET
PMPB33XPZ
20 V, single P-channel Trench MOSFET PMPB33XPZ
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. Features and benefits Trench MOSFET technology Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm Exposed drain pad for excellent thermal conduction Tin-plated 100 % solderable side pads for optical solder inspection Applications Charging switch for portable devices DC-to-DC converters Power management in battery-driven portable devices Hard disk and computing power management

P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

Features and benefits

  • Trench MOSFET technology
  • Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm
  • Exposed drain pad for excellent thermal conduction
  • Tin-plated 100 % solderable side pads for optical solder inspection

Applications

  • Charging switch for portable devices
  • DC-to-DC converters
  • Power management in battery-driven portable devices
  • Hard disk and computing power management
Supplier's Site Datasheet
Single FETs, MOSFETs - 1727-PMPB33XPZTR-ND - DigiKey
Thief River Falls, MN, United States
Single FETs, MOSFETs
1727-PMPB33XPZTR-ND
Single FETs, MOSFETs 1727-PMPB33XPZTR-ND
PMPB33XP/SOT1220/DFN 2020MD-6

PMPB33XP/SOT1220/DFN2020MD-6

Buy Now Datasheet
Single FETs, MOSFETs - 1727-PMPB33XPZDKR-ND - DigiKey
Thief River Falls, MN, United States
Single FETs, MOSFETs
1727-PMPB33XPZDKR-ND
Single FETs, MOSFETs 1727-PMPB33XPZDKR-ND
PMPB33XP/SOT1220/DFN 2020MD-6

PMPB33XP/SOT1220/DFN2020MD-6

Buy Now Datasheet
Single FETs, MOSFETs - 1727-PMPB33XPZCT-ND - DigiKey
Thief River Falls, MN, United States
Single FETs, MOSFETs
1727-PMPB33XPZCT-ND
Single FETs, MOSFETs 1727-PMPB33XPZCT-ND
PMPB33XP/SOT1220/DFN 2020MD-6

PMPB33XP/SOT1220/DFN2020MD-6

Buy Now Datasheet

Technical Specifications

  Nexperia B.V. DigiKey
Product Category Metal-Oxide Semiconductor FET (MOSFET) Transistors
Product Number PMPB33XPZ 1727-PMPB33XPZTR-ND
Product Name 20 V, single P-channel Trench MOSFET Single FETs, MOSFETs
MOSFET Operating Mode Enhancement
V(BR)DSS -20 volts
IDSS -7900 milliamps
VGS(off) 12 volts
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