Automotive qualified N-channel MOSFET using the latest Trench 12 low ohmic split-gate technology, for ultra-low RDS(on) capability, housed in a CCPAK1212 (SOT8000A) package. This product has been fully designed and qualified to meet AEC-Q101 requirements delivering high performance and reliability.
Features and benefits
Fully automotive qualified to AEC-Q101:
175 °C rating suitable for thermally demanding automotive environments.
Trench 12 split-gate trench technology:
Reduced cell pitch enables enhanced power density resulting in lower conduction losses.
Fast and efficient switching with optimal damping for low spiking and improved switching efficiency.
CCPAK mounting base
Large cross-sectional area of exposed drain tab for excellent thermal dissipation and low steady state thermal resistance.
CCPAK gull-wing leads:
High Board Level Reliability (BLR), pins absorbing mechanical stress during thermal cycling.
Visual (AOI) soldering inspection, no need for expensive x-ray equipment.
CCPAK copper clip technology:
Low transient thermal resistance and package inductance.
High maximum current capability and improved current spreading on silicon die.
Applications
Light-electric / Electric vehicle applications
48V to 12V DC-DC Converters
Synchronous rectifier for On-Board Charging (OBC) systems
48V Traction Inverters
48V Belt Starter Generator (BSG)
Battery Management Systems
Automotive qualified N-channel MOSFET using the latest Trench 12 low ohmic split-gate technology, for ultra-low RDS(on) capability, housed in a CCPAK1212 (SOT8000A) package. This product has been fully designed and qualified to meet AEC-Q101 requirements delivering high performance and reliability.
Features and benefits
Fully automotive qualified to AEC-Q101:
- 175 °C rating suitable for thermally demanding automotive environments.
Trench 12 split-gate trench technology:
- Reduced cell pitch enables enhanced power density resulting in lower conduction losses.
- Fast and efficient switching with optimal damping for low spiking and improved switching efficiency.
CCPAK mounting base
- Large cross-sectional area of exposed drain tab for excellent thermal dissipation and low steady state thermal resistance.
CCPAK gull-wing leads:
- High Board Level Reliability (BLR), pins absorbing mechanical stress during thermal cycling.
- Visual (AOI) soldering inspection, no need for expensive x-ray equipment.
CCPAK copper clip technology:
- Low transient thermal resistance and package inductance.
- High maximum current capability and improved current spreading on silicon die.
Applications
- Light-electric / Electric vehicle applications
- 48V to 12V DC-DC Converters
- Synchronous rectifier for On-Board Charging (OBC) systems
- 48V Traction Inverters
- 48V Belt Starter Generator (BSG)
- Battery Management Systems
