Planar Schottky barrier dual diode encapsulated in an leadless ultra small SOT883 (SC-101)Surface-Moun
ted Device (SMD) plastic package.
Features and benefits
Low forward voltage
Leadless ultra small plastic package (1.0 x 0.6 x 0.5 mm)
Boardspace 1.17 mm² (approx. 10% of SOT23)
Power dissipation comparable to SOT23
Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
Ultra high-speed switching
Voltage clamping
Protection circuits
Mobile communications, digital (still) cameras, PDAs and PCMCIA cards
Planar Schottky barrier dual diode encapsulated in an leadless ultra small SOT883 (SC-101)Surface-Mounted Device (SMD) plastic package.
Features and benefits
- Low forward voltage
- Leadless ultra small plastic package (1.0 x 0.6 x 0.5 mm)
- Boardspace 1.17 mm² (approx. 10% of SOT23)
- Power dissipation comparable to SOT23
- Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
- Ultra high-speed switching
- Voltage clamping
- Protection circuits
- Mobile communications, digital (still) cameras, PDAs and PCMCIA cards
