NEC / Schott High Frequency TO and Microelectronic Packages

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High Frequency TO and Microelectronic Packages -  - NEC / Schott
Koka - Shi, Shiga, Japan
High Frequency TO and Microelectronic Packages
Data communication networks are becoming increasingly faster. However, data can only be transferred at high speed if all of the components involved are designed for operation at high frequencies. Hence, the easiest way to speed up data transfer rates in communication networks is to replace the transmission and reception components. Transistor Outlines (TO) and Microelectronic Packages Hermetically sealed housings for high frequency components come in a range of designs, and enable large volumes of data to be transmitted in existing structures - particularly in TO packages. We produce customized solutions for these areas of application ranging from high-volume TO headers (TO PLUS®) to customized microelectronic (or hybrid) packages. TO PLUS® packages can be designed to deliver data throughputs of up to 28GB/s. The advantage to you: TO PLUS® packages are extremely low-loss and feature high-tolerance accuracy and high-frequency connections. TO PLUS® is fully compatible with existing TO caps and with standard assembly processes. Upgrading communication networks Most transmission and reception technologies were developed based on the fundamentals of TOs, hence, it is not necessary for communication application manufacturers to change their products, as they can simply upgrade their networks instead. In-house simulation and measurement technology We are a specialist in simulation and measuring technology. Please feel free to contact our experts for an in-depth consultation - from design development to the finished product - about your needs.
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Technical Specifications

  NEC / Schott
Product Category IC Interconnect Components
Product Name High Frequency TO and Microelectronic Packages
Mounting SMT; Through-Hole
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