Murata Electronics Balun LDB311G5010C-300

Description
MULTI-LAY HYBRID BALUNS 1206
  • Balun - LDB311G5010C-300 - ODG (Origin Data Global)
    ODG (Origin Data Global)
Request a Quote Datasheet
Description
MULTI-LAY HYBRID BALUNS 1206
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Balun - LDB311G5010C-300 - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
Balun
LDB311G5010C-300
Balun LDB311G5010C-300
MULTI-LAY HYBRID BALUNS 1206

MULTI-LAY HYBRID BALUNS 1206

Supplier's Site Datasheet
Shenzhen Shengyu Electronics Technology Limited
Futian, China
RF and Wireless - Balun
LDB311G5010C-300
RF and Wireless - Balun LDB311G5010C-300
MULTI-LAY HYBRID BALUNS 1206

MULTI-LAY HYBRID BALUNS 1206

Supplier's Site

Technical Specifications

  ODG (Origin Data Global) Shenzhen Shengyu Electronics Technology Limited
Product Category Network and Communication Chips Network and Communication Chips
Product Number LDB311G5010C-300 LDB311G5010C-300
Product Name Balun RF and Wireless - Balun
Operating Frequency 1400 to 1600 MHz
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