Murata Electronics RF and Wireless - Balun LDB215G5110C-001

Description
MULTI-LAY HYBRID BALUNS 0805
  • Balun - LDB215G5110C-001 - ODG (Origin Data Global)
    ODG (Origin Data Global)
Datasheet
Description
MULTI-LAY HYBRID BALUNS 0805
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Shenzhen Shengyu Electronics Technology Limited
Futian, China
RF and Wireless - Balun
LDB215G5110C-001
RF and Wireless - Balun LDB215G5110C-001
MULTI-LAY HYBRID BALUNS 0805

MULTI-LAY HYBRID BALUNS 0805

Supplier's Site
Balun - LDB215G5110C-001 - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
Balun
LDB215G5110C-001
Balun LDB215G5110C-001
MULTI-LAY HYBRID BALUNS 0805

MULTI-LAY HYBRID BALUNS 0805

Supplier's Site Datasheet

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited ODG (Origin Data Global)
Product Category Network and Communication Chips Network and Communication Chips
Product Number LDB215G5110C-001 LDB215G5110C-001
Product Name RF and Wireless - Balun Balun
Package Type 0805 (2012 Metric)
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