Murata Electronics RF and Wireless - Balun LDB212G1010C-001

Description
MULTI-LAY HYBRID BALUNS 0805
  • RF and Wireless - Balun - LDB212G1010C-001 - Acme Chip Technology Co., Limited
    Acme Chip Technology Co., Limited
  • Balun - LDB212G1010C-001 - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Datasheet
Description
MULTI-LAY HYBRID BALUNS 0805
Datasheet

Suppliers

Company
Product
Description
Supplier Links
RF and Wireless - Balun - LDB212G1010C-001 - Acme Chip Technology Co., Limited
Acme Chip Technology Co., Limited
Shenzhen, China
RF and Wireless - Balun
LDB212G1010C-001
RF and Wireless - Balun LDB212G1010C-001
MULTI-LAY HYBRID BALUNS 0805

MULTI-LAY HYBRID BALUNS 0805

Supplier's Site
Balun - LDB212G1010C-001 - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Balun
LDB212G1010C-001
Balun LDB212G1010C-001
RF Balun 2GHz ~ 2.2GHz 50 / 100Ohm 0805 (2012 Metric)

RF Balun 2GHz ~ 2.2GHz 50 / 100Ohm 0805 (2012 Metric)

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Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Data Baluns Data Baluns
Product Number LDB212G1010C-001 LDB212G1010C-001
Product Name RF and Wireless - Balun Balun
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