Murata Electronics Balun LDB211G6610C-002

Description
MULTI-LAY HYBRID BALUNS 0805
  • Balun - LDB211G6610C-002 - ODG (Origin Data Global)
    ODG (Origin Data Global)
Request a Quote Datasheet
Description
MULTI-LAY HYBRID BALUNS 0805
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Balun - LDB211G6610C-002 - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
Balun
LDB211G6610C-002
Balun LDB211G6610C-002
MULTI-LAY HYBRID BALUNS 0805

MULTI-LAY HYBRID BALUNS 0805

Supplier's Site Datasheet
Shenzhen Shengyu Electronics Technology Limited
Futian, China
RF and Wireless - Balun
LDB211G6610C-002
RF and Wireless - Balun LDB211G6610C-002
MULTI-LAY HYBRID BALUNS 0805

MULTI-LAY HYBRID BALUNS 0805

Supplier's Site

Technical Specifications

  ODG (Origin Data Global) Shenzhen Shengyu Electronics Technology Limited
Product Category Network and Communication Chips Network and Communication Chips
Product Number LDB211G6610C-002 LDB211G6610C-002
Product Name Balun RF and Wireless - Balun
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