Murata Electronics Balun LDB183G7010C-110

Description
MULTI-LAY HYBRID BALUNS
  • Balun - LDB183G7010C-110 - ODG (Origin Data Global)
    ODG (Origin Data Global)
Request a Quote Datasheet
Description
MULTI-LAY HYBRID BALUNS
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Balun - LDB183G7010C-110 - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
Balun
LDB183G7010C-110
Balun LDB183G7010C-110
MULTI-LAY HYBRID BALUNS

MULTI-LAY HYBRID BALUNS

Supplier's Site Datasheet
Shenzhen Shengyu Electronics Technology Limited
Futian, China
RF and Wireless - Balun
LDB183G7010C-110
RF and Wireless - Balun LDB183G7010C-110
MULTI-LAY HYBRID BALUNS

MULTI-LAY HYBRID BALUNS

Supplier's Site

Technical Specifications

  ODG (Origin Data Global) Shenzhen Shengyu Electronics Technology Limited
Product Category Network and Communication Chips Network and Communication Chips
Product Number LDB183G7010C-110 LDB183G7010C-110
Product Name Balun RF and Wireless - Balun
Operating Frequency 3400 to 4000 MHz
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