Murata Electronics Silicon Chip Capacitors (Wire bondable) 935153837522-T3T

Description
UWSC Capacitors target optical communication systems (ROSA / TOSA, SONET and all optoelectronics) as well as high speed data systems or products. The UWSC are designed for DC decoupling and bypass applications. The unique technology of integrated passive devices in silicon developed by Murata*, offers high rejection at frequencies higher than 26GHz. The UWSC capacitors are manufactured with both deep trench and MOS semiconductor processes to cover low and high capacitance requirements. The UWSC Capacitors provide very high reliability and capacitance stability over temperature (+60ppm/K) and voltage. They have and extended operating temperature range from -55 to 150 C. Reliable and repeatable performances are obtained thanks to a fully controlled production line with high temperature curing (above 900 C) generating a highly pure oxide. These capacitors are compatible with standard wirebonding assembly (ball and wedge). They are RoHS-compliant and are available with thick gold terminations.
Request a Quote Datasheet
Description
UWSC Capacitors target optical communication systems (ROSA / TOSA, SONET and all optoelectronics) as well as high speed data systems or products. The UWSC are designed for DC decoupling and bypass applications. The unique technology of integrated passive devices in silicon developed by Murata*, offers high rejection at frequencies higher than 26GHz. The UWSC capacitors are manufactured with both deep trench and MOS semiconductor processes to cover low and high capacitance requirements. The UWSC Capacitors provide very high reliability and capacitance stability over temperature (+60ppm/K) and voltage. They have and extended operating temperature range from -55 to 150 C. Reliable and repeatable performances are obtained thanks to a fully controlled production line with high temperature curing (above 900 C) generating a highly pure oxide. These capacitors are compatible with standard wirebonding assembly (ball and wedge). They are RoHS-compliant and are available with thick gold terminations.
Request a Quote Datasheet

Suppliers

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Product
Description
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Silicon Chip Capacitors (Wire bondable) - 935153837522-T3T - Richardson RFPD
Downers Grove, IL, United States
Silicon Chip Capacitors (Wire bondable)
935153837522-T3T
Silicon Chip Capacitors (Wire bondable) 935153837522-T3T
UWSC Capacitors target optical communication systems (ROSA / TOSA, SONET and all optoelectronics) as well as high speed data systems or products. The UWSC are designed for DC decoupling and bypass applications. The unique technology of integrated passive devices in silicon developed by Murata*, offers high rejection at frequencies higher than 26GHz. The UWSC capacitors are manufactured with both deep trench and MOS semiconductor processes to cover low and high capacitance requirements. The UWSC Capacitors provide very high reliability and capacitance stability over temperature (+60ppm/K) and voltage. They have and extended operating temperature range from -55 to 150 C. Reliable and repeatable performances are obtained thanks to a fully controlled production line with high temperature curing (above 900 C) generating a highly pure oxide. These capacitors are compatible with standard wirebonding assembly (ball and wedge). They are RoHS-compliant and are available with thick gold terminations.

UWSC Capacitors target optical communication systems (ROSA / TOSA, SONET and all optoelectronics) as well as high speed data systems or products. The UWSC are designed for DC decoupling and bypass applications. The unique technology of integrated passive devices in silicon developed by Murata*, offers high rejection at frequencies higher than 26GHz. The UWSC capacitors are manufactured with both deep trench and MOS semiconductor processes to cover low and high capacitance requirements. The UWSC Capacitors provide very high reliability and capacitance stability over temperature (+60ppm/K) and voltage. They have and extended operating temperature range from -55 to 150 C. Reliable and repeatable performances are obtained thanks to a fully controlled production line with high temperature curing (above 900 C) generating a highly pure oxide. These capacitors are compatible with standard wirebonding assembly (ball and wedge). They are RoHS-compliant and are available with thick gold terminations.

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD
Product Category Capacitors
Product Number 935153837522-T3T
Product Name Silicon Chip Capacitors (Wire bondable)
Configuration / Form Factor Chip Capacitor
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