multicomp PRO Thermal Pad, Silicone, 200X3Mm, Blue Rohs Compliant Multicomp Pro MPGCS-030K-200-3.0

Description
THERMAL PAD, SILICONE, 200X3MM, BLUE ROHS COMPLIANT: YES
Datasheet
Description
THERMAL PAD, SILICONE, 200X3MM, BLUE ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, Silicone, 200X3Mm, Blue Rohs Compliant Multicomp Pro - 41AH5845 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, Silicone, 200X3Mm, Blue Rohs Compliant Multicomp Pro
41AH5845
Thermal Pad, Silicone, 200X3Mm, Blue Rohs Compliant Multicomp Pro 41AH5845
THERMAL PAD, SILICONE, 200X3MM, BLUE ROHS COMPLIANT: YES

THERMAL PAD, SILICONE, 200X3MM, BLUE ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5845
Product Name Thermal Pad, Silicone, 200X3Mm, Blue Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed - QSil-553 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics; OEM or Industrial
Features Flame Retardant; UL Rating
View Details
Flexible thermal conductive insulating film for power semiconductors - SC1000FG - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Highly Thermally Conductive and Non-Flammable Interface Material - SARCON ® XR-Pe - Fujipoly® America Corp.
Specs
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0394 to 0.0787 inch (1 to 2 mm)
View Details