multicomp PRO Thermal Pad, Silicone, 200X1.5Mm, Blue Rohs Compliant Multicomp Pro MPGCS-030K-200-1.5

Description
THERMAL PAD, SILICONE, 200X1.5MM, BLUE ROHS COMPLIANT: YES
  • Thermal Pad, Silicone, 200X1.5Mm, Blue Rohs Compliant Multicomp Pro - 41AH5843 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL PAD, SILICONE, 200X1.5MM, BLUE ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, Silicone, 200X1.5Mm, Blue Rohs Compliant Multicomp Pro - 41AH5843 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, Silicone, 200X1.5Mm, Blue Rohs Compliant Multicomp Pro
41AH5843
Thermal Pad, Silicone, 200X1.5Mm, Blue Rohs Compliant Multicomp Pro 41AH5843
THERMAL PAD, SILICONE, 200X1.5MM, BLUE ROHS COMPLIANT: YES

THERMAL PAD, SILICONE, 200X1.5MM, BLUE ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5843
Product Name Thermal Pad, Silicone, 200X1.5Mm, Blue Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Liquid Gap Fillers for Electronics - Electrolube ® LGF200 Liquid Gap Filler - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Liquid Gap Fillers for Electronics
Electrolube ® LGF200 Liquid Gap Filler
Specs
Cure / Technology Two Component  
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
View Details
High efficiency thermal pad for chipset - SF700 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High efficiency thermal pad for chipset
SF700
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 302 F (-50 to 150 C)
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
CHT USA Inc.
2-Part, Silicone Potting Compound and Encapsulant, UL Listed
QSil-563
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details