multicomp PRO Thermal Pad, Silicone, 200X0.5Mm, Blue Rohs Compliant Multicomp Pro MPGCS-030K-200-0.5

Description
THERMAL PAD, SILICONE, 200X0.5MM, BLUE ROHS COMPLIANT: YES
Datasheet
Description
THERMAL PAD, SILICONE, 200X0.5MM, BLUE ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, Silicone, 200X0.5Mm, Blue Rohs Compliant Multicomp Pro - 41AH5841 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, Silicone, 200X0.5Mm, Blue Rohs Compliant Multicomp Pro
41AH5841
Thermal Pad, Silicone, 200X0.5Mm, Blue Rohs Compliant Multicomp Pro 41AH5841
THERMAL PAD, SILICONE, 200X0.5MM, BLUE ROHS COMPLIANT: YES

THERMAL PAD, SILICONE, 200X0.5MM, BLUE ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5841
Product Name Thermal Pad, Silicone, 200X0.5Mm, Blue Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-3 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 850 F (0 to 454 C)
View Details
Thermal Pads - 9156048 - RS Components, Ltd.
RS Components, Ltd.
Specs
Chemical System Silicone
View Details
Two Component Nickel Conductive Epoxy Adhesive - EP21TDCNFL - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details