multicomp PRO Thermal Pad, Silicone, 150X3Mm, Blue Rohs Compliant Multicomp Pro MPGCS-030-GF-150-3.0

Description
THERMAL PAD, SILICONE, 150X3MM, BLUE ROHS COMPLIANT: YES
Datasheet
Description
THERMAL PAD, SILICONE, 150X3MM, BLUE ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, Silicone, 150X3Mm, Blue Rohs Compliant Multicomp Pro - 41AH5835 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, Silicone, 150X3Mm, Blue Rohs Compliant Multicomp Pro
41AH5835
Thermal Pad, Silicone, 150X3Mm, Blue Rohs Compliant Multicomp Pro 41AH5835
THERMAL PAD, SILICONE, 150X3MM, BLUE ROHS COMPLIANT: YES

THERMAL PAD, SILICONE, 150X3MM, BLUE ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5835
Product Name Thermal Pad, Silicone, 150X3Mm, Blue Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
ATROX ® 590-4HT1 -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Form / Shape Die Bonding Adhesives
Composition Filled
Industry Electronics; Semiconductors, IC's
View Details
Two Component, Low Viscosity Epoxy Features Outstanding Chemical Resistance - EP62-1BF - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
View Details