multicomp PRO Non-Silicone Thermal Pad, 150X1.5Mm, Blu Rohs Compliant Multicomp Pro MPGCS-020NSB-150-1.5A

Description

NON-SILICONE THERMAL PAD, 150X1.5MM, BLU ROHS COMPLIANT: YES

Newark, An Avnet Company

Datasheet

Description

NON-SILICONE THERMAL PAD, 150X1.5MM, BLU ROHS COMPLIANT: YES

Datasheet

Suppliers

Company

Product

Description

Supplier Links

Newark, An Avnet Company

Chicago, IL, United States

Non-Silicone Thermal Pad, 150X1.5Mm, Blu Rohs Compliant Multicomp Pro
41AH5826

Non-Silicone Thermal Pad, 150X1.5Mm, Blu Rohs Compliant Multicomp Pro 41AH5826

NON-SILICONE THERMAL PAD, 150X1.5MM, BLU ROHS COMPLIANT: YES

Supplier's Site

Datasheet

Technical Specifications

	Newark, An Avnet Company
Product Category	Thermal Compounds and Thermal Interface Materials
Product Number	41AH5826
Product Name	Non-Silicone Thermal Pad, 150X1.5Mm, Blu Rohs Compliant Multicomp Pro

Unlock Full Specs

to access all available technical data

Similar Products

Master Bond, Inc.

Thermally Conductive, Heat Resistant Epoxy

EP21TCHT-1

Specs

Type High Dielectric

Cure / Technology Thermoset; Two Component

Form / Shape Liquid; Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket

View Details

ELANTAS North America LLC

Ripley™

E 468-2-7-55F

Specs

Type High Dielectric

Cure / Technology Thermoset; Single Component

Form / Shape Liquid

View Details

Dongguan Sheen Electronic Technology Co., Ltd.

Thermal conductive gel pad for mobile phone smartphone

SF400

Specs

Form / Shape Pad

Industry Electronics

Use Temperature -58 to 392 F (-50 to 200 C)

View Details

Quantaflex Printed Electronics Inc.

Thermal Interface Materials

Specs

Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket

Industry Electronics; Semiconductors, IC's

Features EMI/RFI Shielding

View Details