multicomp PRO Non-Silicone Thermal Pad, 150X0.5Mm, Blu Rohs Compliant Multicomp Pro MPGCS-020NSB-150-0.5A

Description

NON-SILICONE THERMAL PAD, 150X0.5MM, BLU ROHS COMPLIANT: YES

Newark, An Avnet Company

Datasheet

Description

NON-SILICONE THERMAL PAD, 150X0.5MM, BLU ROHS COMPLIANT: YES

Datasheet

Suppliers

Company

Product

Description

Supplier Links

Newark, An Avnet Company

Chicago, IL, United States

Non-Silicone Thermal Pad, 150X0.5Mm, Blu Rohs Compliant Multicomp Pro
41AH5824

Non-Silicone Thermal Pad, 150X0.5Mm, Blu Rohs Compliant Multicomp Pro 41AH5824

NON-SILICONE THERMAL PAD, 150X0.5MM, BLU ROHS COMPLIANT: YES

Supplier's Site

Datasheet

Technical Specifications

	Newark, An Avnet Company
Product Category	Thermal Compounds and Thermal Interface Materials
Product Number	41AH5824
Product Name	Non-Silicone Thermal Pad, 150X0.5Mm, Blu Rohs Compliant Multicomp Pro

Unlock Full Specs

to access all available technical data

Similar Products

Fujipoly® America Corp.

Highly Thermal Conductive, Electricity Insulative, Low Viscosity type Silicone Compound

SARCON ® SPG-50A

Specs

Form / Shape Gap Filler, Foam in Place Gasket

Chemical System Silicone

Industry Electronics; Semiconductors, IC's

View Details

Master Bond, Inc.

Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity

EP30LP-2

Specs

Type High Dielectric; Optical

Cure / Technology Thermoset; Two Component ; Room Temperature Vulcanizing or Curing

Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket

View Details

RS Components, Ltd.

Thermal Pads

7580926

View Details

Quantaflex Printed Electronics Inc.

Thermal Interface Materials

Specs

Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket

Industry Electronics; Semiconductors, IC's

Features EMI/RFI Shielding

View Details