multicomp PRO Non-Silicone Thermal Pad, 200X1Mm, Gry Rohs Compliant Multicomp Pro MPGCS-020NS-200-1.0

Description
NON-SILICONE THERMAL PAD, 200X1MM, GRY ROHS COMPLIANT: YES
Datasheet
Description
NON-SILICONE THERMAL PAD, 200X1MM, GRY ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Non-Silicone Thermal Pad, 200X1Mm, Gry Rohs Compliant Multicomp Pro - 41AH5820 - Newark, An Avnet Company
Chicago, IL, United States
Non-Silicone Thermal Pad, 200X1Mm, Gry Rohs Compliant Multicomp Pro
41AH5820
Non-Silicone Thermal Pad, 200X1Mm, Gry Rohs Compliant Multicomp Pro 41AH5820
NON-SILICONE THERMAL PAD, 200X1MM, GRY ROHS COMPLIANT: YES

NON-SILICONE THERMAL PAD, 200X1MM, GRY ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5820
Product Name Non-Silicone Thermal Pad, 200X1Mm, Gry Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Thermal conductive gel pad for mobile phone smartphone - SF400 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability - MasterSil 157 - Master Bond, Inc.
Specs
Type High Dielectric; Optical
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
View Details