multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro MP008837

Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES
Description
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro - 25AK3588 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro
25AK3588
Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro 25AK3588
THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 150Mm x 150Mm x 2MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3588
Product Name Thermal Interface Pad, 150Mm X 150Mm X 2Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion - EP42HT-3AO - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid; Encapsulant or Conformal Coating
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
RS Components, Ltd.
Specs
Use Temperature -40 to 257 F (-40 to 125 C)
Thermal Conductivity 4 W/m-K (2.31 BTU-ft/hr-ft²-F)
View Details