multicomp PRO Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro MP008829

Description
THERMAL INTERFACE PAD, 200Mm x 200Mm x 0.5MM ROHS COMPLIANT: YES
  • Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro - 25AK3580 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
THERMAL INTERFACE PAD, 200Mm x 200Mm x 0.5MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro - 25AK3580 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro
25AK3580
Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro 25AK3580
THERMAL INTERFACE PAD, 200Mm x 200Mm x 0.5MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 200Mm x 200Mm x 0.5MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3580
Product Name Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
CHT USA Inc.
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed
AS1707
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
Form-In-Place Gap Filler - SARCON® SPG-70A - Fujipoly® America Corp.
Fujipoly® America Corp.
Form-In-Place Gap Filler
SARCON® SPG-70A
Specs
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Industry Electronics
View Details
One Part Epoxy for Bonding and Glob Top Applications - Supreme 3HTND-2GT - Master Bond, Inc.
Master Bond, Inc.
One Part Epoxy for Bonding and Glob Top Applications
Supreme 3HTND-2GT
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D
746D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details