multicomp PRO Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro MP008829

Description
THERMAL INTERFACE PAD, 200Mm x 200Mm x 0.5MM ROHS COMPLIANT: YES
  • Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro - 25AK3580 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
THERMAL INTERFACE PAD, 200Mm x 200Mm x 0.5MM ROHS COMPLIANT: YES

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro - 25AK3580 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro
25AK3580
Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro 25AK3580
THERMAL INTERFACE PAD, 200Mm x 200Mm x 0.5MM ROHS COMPLIANT: YES

THERMAL INTERFACE PAD, 200Mm x 200Mm x 0.5MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 25AK3580
Product Name Thermal Interface Pad, 200Mm X 200Mm X 0.5Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D
746D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Electrolube ® 2K301P - - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Electrolube ® 2K301P
Specs
Cure / Technology Two Component  
Form / Shape Encapsulant or Conformal Coating
Industry Automotive; Electronics; Semiconductors, IC's
View Details
Thermally Conductive, Low Outgassing Epoxy - EP30AN-1 - Master Bond, Inc.
Master Bond, Inc.
Thermally Conductive, Low Outgassing Epoxy
EP30AN-1
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details