multicomp PRO Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro MP008828

Description

THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES

Newark, An Avnet Company

Description

THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES

Suppliers

Company

Product

Description

Supplier Links

Newark, An Avnet Company

Chicago, IL, United States

Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro
25AK3579

Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro 25AK3579

THERMAL INTERFACE PAD, 150Mm x 150Mm x 3MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

	Newark, An Avnet Company
Product Category	Thermal Compounds and Thermal Interface Materials
Product Number	25AK3579
Product Name	Thermal Interface Pad, 150Mm X 150Mm X 3Mm Rohs Compliant Multicomp Pro

Unlock Full Specs

to access all available technical data

Similar Products

Thermon, Inc

Heat Transfer Compound

T-99

Specs

Cure / Technology Single Component

Form / Shape Die Bonding Adhesives; Grease, Paste

Use Temperature 32 to 2200 F (0 to 1204 C)

View Details

RS Components, Ltd.

Thermal Pads

7074617

View Details

Master Bond, Inc.

Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system

EP39MAOHT

Specs

Type High Dielectric

Cure / Technology Thermoset; Two Component ; Room Temperature Vulcanizing or Curing

Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket

View Details

Quantaflex Printed Electronics Inc.

Thermal Interface Materials

Specs

Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket

Industry Electronics; Semiconductors, IC's

Features EMI/RFI Shielding

View Details